- Manufacturer:
-
- 3M (6)
- BOYD (5)
- Carlo Gavazzi (1)
- Cooling Source (1)
- GC Electronics (1)
- GELID SOLUTIONS (3)
- Henkel/Loctite (8)
- Interlight (1)
- Littelfuse (2)
- MG Chemicals (11)
- Wakefield Thermal (19)
- Product Status:
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- Size / Dimension:
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- Storage/Refrigeration Temperature:
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- Thermal Conductivity:
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- Type:
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93 Records
Image | Part | Manufacturer | Description | Stock | Action | |
---|---|---|---|---|---|---|
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BOYD | THERMALBOND EPOXY 7OZ PACKET |
26
In-stock
|
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BOYD | THERMALBOND EPOXY 3.5OZ PACKET |
21
In-stock
|
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MG Chemicals | EPOXY MOLD RELEASE (NON SILICONE |
17
In-stock
|
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ACL Staticide, Inc. | HEAT SINK GREASE |
52
In-stock
|
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BOYD | THERMALBOND EPOXY 0.875OZ PACKET |
8,260
In-stock
|
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Carlo Gavazzi | SILICONE HEATSINK PASTE 2ML |
27
In-stock
|
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Littelfuse | COMPOUND HEAT SINK 2OZ JAR |
8
In-stock
|
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Wakefield Thermal | SILVER FILLED BONDATHERM 2 GRAM |
51
In-stock
|
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Wakefield Thermal | ALUMINUM FILLED BONDATHERM EPOXY |
58
In-stock
|
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Wakefield Thermal | TWO DUAL CATRIDGES (BT-102-50M), |
13
In-stock
|
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MG Chemicals | ULTRA THERMAL PASTE, 6 W/M.K |
9
In-stock
|
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GELID SOLUTIONS | THERMAL COMPOUND 10GR, 8.5W |
26
In-stock
|
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EUROPEAN THERMODYNAMICS | NON SIL PUTTY, 1.5W/MK, 100ML |
18
In-stock
|
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EUROPEAN THERMODYNAMICS | NON SIL PUTTY, 3.0W/MK, 100ML |
20
In-stock
|
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EUROPEAN THERMODYNAMICS | NON SILICONE GREASE,4W/M K, 1KG |
7
In-stock
|
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Littelfuse | HEAT SINK COMP. SARAN PKG 2GR |
17
In-stock
|
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CAIG Laboratories, Inc. | SILICONE HEAT SINK COMPOUND SQUE |
12
In-stock
|
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Wakefield Thermal | TOUGHENED, FLEXIBLE ADHESIVE SYS |
6,361
In-stock
|
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MG Chemicals | PREMIUM THERMAL PASTE, 3 W/M.K |
10
In-stock
|
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MG Chemicals | ULTRA THERMAL PASTE, 6 W/M.K |
5
In-stock
|
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