Adhesives, Epoxies, Greases, Pastes - GUANGHONGFA (HK)TECHNOLOGY CO., LIMITED

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6 Records

Part	Manufacturer	Description		Stock	Action
TC3-10G	Chip Quik, Inc.	HEAT SINK THERMAL COMPOUND	RFQ	51 In-stock	View details Get Quote
TC3-1G	Chip Quik, Inc.	HEAT SINK THERMAL COMPOUND	RFQ	7,975 In-stock	View details Get Quote
TC3-3.5G	Chip Quik, Inc.	HEAT SINK THERMAL COMPOUND	RFQ	9,661 In-stock	View details Get Quote
TC-GC-03-D	GELID SOLUTIONS	THERMAL COMPOUND 1GR, 8.5W	RFQ	7,191 In-stock	View details Get Quote
TC-GC-03-A	GELID SOLUTIONS	THERMAL COMPOUND 3.5GR, 8.5W	RFQ	5,373 In-stock	View details Get Quote
DM-TIM-15085-SYP-10	Dycotec Materials	NON-SILICONE THERMAL PUTTY 8.5 W	RFQ	16 In-stock	View details Get Quote

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