- Manufacturer：
-
- Chip Quik, Inc. (11)
- Henkel/Loctite (1)
- Jones Tech (9)
- MG Chemicals (13)
- Features：
-
- Product Status：
-
- Size / Dimension：
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- Storage/Refrigeration Temperature：
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- Thermal Conductivity：
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58 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Taica Corporation | THERMAL PASTE, 30CC SYRINGE |
205
In-stock
|
View details Get Quote | ||
|
|
MG Chemicals | ADHESIVE - THERMAL CONDUCTIVE EP |
89
In-stock
|
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|
|
MG Chemicals | ADHESIVE - THERMAL CONDUCTIVE EP |
54
In-stock
|
View details Get Quote | ||
|
|
MG Chemicals | FAST CURE THERM COND ADH FLOW |
55
In-stock
|
View details Get Quote | ||
|
|
Chip Quik, Inc. | HEAT SINK THERMAL COMPOUND |
51
In-stock
|
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|
|
MG Chemicals | FAST CURE THERM COND ADH FLOW |
37
In-stock
|
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|
|
MG Chemicals | SLOW CURE THERM COND ADH FLOW |
38
In-stock
|
View details Get Quote | ||
|
|
Chip Quik, Inc. | HEAT SINK THERMAL COMPOUND - DEE |
13
In-stock
|
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|
|
Chip Quik, Inc. | HEAT SINK COMPOUND - GREY ULTRA |
12
In-stock
|
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|
|
MG Chemicals | SLOW CURE THERM COND ADH FLOW |
13
In-stock
|
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|
Laird - Performance Materials | TPUTTY 508 SYRINGE 30CC |
2
In-stock
|
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|
|
MG Chemicals | EPOXY |
17
In-stock
|
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|
|
Chip Quik, Inc. | HEAT SINK THERMAL COMPOUND - DEE |
17
In-stock
|
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|
|
Chip Quik, Inc. | HEAT SINK THERMAL COMPOUND - DEE |
7,980
In-stock
|
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|
|
Chip Quik, Inc. | HEAT SINK THERMAL COMPOUND - DEE |
8,792
In-stock
|
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|
|
Chip Quik, Inc. | HEAT SINK THERMAL COMPOUND - DEE |
1
In-stock
|
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|
|
Laird - Performance Materials | TPUTTY 508 |
7,948
In-stock
|
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|
|
Laird - Performance Materials | TPUTTY 607 75CC EFD CARTRIDGE |
9,406
In-stock
|
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|
|
Laird - Performance Materials | TPUTTY 508 |
8,746
In-stock
|
View details Get Quote | ||
|
|
Laird - Performance Materials | TPUTTY 607 SYRINGE 30CC |
6,441
In-stock
|
View details Get Quote |
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